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          On the current PCB skill development trend:

          1、 Develop along the path of high density interconnect skills (HDI)

          Because HDI embodies the most advanced skills of contemporary PCB, it brings precision wire and micro aperture to PCB. Among the terminal electronic products used by HDI multilayer board - mobile phone (mobile phone) is a model of cutting-edge development skills of HDI. Micro wire (50) of PCB main board in mobile phone μ m~75 μ m/50 μ m~75 μ m. Conductor width / spacing) has become the mainstream. In addition, the thickness of conductive layer and plate has become thin; The miniaturization of conductive patterns leads to high density and high performance of electronic equipment.


          2、 Component embedding skills have strong vitality

          The inner layer of PCB forms semiconductor device (called active component), electronic component (called passive component) or passive component function & quot; Component embedded PCB & quot; The development of high-volume production and component embedding technology is a great innovation of PCB functional integrated circuits. However, it is necessary to deal with imitation planning methods in order to develop production skills and ensure quality and reliability.

          We need to increase resource investment in systems including planning, equipment, testing and imitation in order to maintain strong vitality.


          3、 The development of materials in PCB should go to a higher level

          Whether rigid pcb or flexible PCB materials, with the lead-free of global electronic products, it is necessary to make these materials have higher heat resistance. Therefore, new materials with high Tg, small coefficient of thermal expansion, small dielectric constant and excellent tangent of dielectric loss angle continue to emerge.


          4、 Optoelectronic PCB has broad prospects

          It uses the optical path layer and circuit layer to transmit signals. The key to this new skill is to make the optical path layer (optical waveguide layer). It is an organic polymer, which is composed of lithography, laser ablation, reactive ion etching and so on. At present, this skill has been industrialized in Japan and the United States.


          5、 The manufacturing process shall be updated and advanced equipment shall be introduced

          1. Manufacturing process

          HDI production has matured and tends to be improved. With the development of PCB skills, although the reduction method commonly used in the past is still dominant, low-cost processes such as addition method and semi addition method are beginning to rise.

          Using nano technology to metalize holes to form PCB conductive patterns, a new process for making flexible board.

          High reliability and high quality printing method and inkjet PCB process.

          2. Advanced equipment

          It produces precision wires, high-resolution photomask and exposure devices, and laser direct exposure devices.

          Uniform co plating equipment.

          Production of embedded components (passive and active components) manufacturing and installation equipment and facilities.


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